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Wafer Handling System

 

 

 

 

LUDL (Lep)
Handlers for 3-12", both AC and DC driven with staging

GENERAL DESCRIPTION:

The New LEP R92 Robot offers the highest throughput available.  The robot incorporates four axes of motion.  The lift and rotation locate the cassette and wafer slot.  The dual-radius arm arrangement provides the capability of having two wafers in the system simultaneously.  This means that while one wafer is being processed, the robot can fetch the next wafer and have it ready when the process is completed.  The robot can then remove the processed wafer with the empty arm and replace it with the next wafer that is already on the other arm.

FEATURES:

  • Dual end effectors for more wafer throughput
  • Wafer capacity: 75 to 300mm (3 to 12 inches)
  • Wafer pickup height is only 10 inches from robot mounting surface
  • Closed-loop servo drives
  • Fail-safe features
  • Completely enclosed housing for contamination reduction
  • Handles 1.0 pound payload
  • Easily serviced modular construction
  • Motion path is compatible with wafers, masks, magnetic disks, film frames, and ceramic substrates
  • Service Manufactured in U.S. which assures:

Fast delivery

Fast repair

Fast spare parts shipping

Easy access for technical support

 

  AUTOMATED IMAGING SYSTEMS
 
  • Auto-Macro Inspection Module
  • Wafer Inspection System
  • Wafer Sorting System
  • Automated Failure Analysis
  • Defect Review / OCR Read

 

AIS PRODUCTS:

   

 

   
 
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Revised: February 18, 2010.

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